#1AA + + + + + + + + Oreste Donzella, Executive Vice President EPC Group + + + KLA and Advanced Packaging + + + + + KLA+ + + + + + + + + + + June 16, 2021#2Forward-Looking Statements Statements in this presentation other than historical facts, such as statements pertaining to: (i) industry trends; (ii) customer demand and investment strategy; (iii) anticipated synergies from acquisitions; (iv) hiring by KLA; (v) anticipated dividends and share repurchases; (vi) WFE and KLA cyclicality; (vii) projected end-demand uses for semiconductors; (viii) growth of KLA's service business; (ix) sales, revenue growth rate, operating margin, EPS, capital allocation, semiconductor industry CAGR, capital intensity, memory and foundry/logic mix, process control market growth rate and growth in new markets through 2023; are forward-looking statements and subject to the Safe Harbor provisions created by the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on current information and expectations, and involve a number of risks and uncertainties. Actual results may differ materially from those projected in such statements due to various factors, including but not limited to: the future impacts of the COVID-19 pandemic; the demand for semiconductors; the financial condition of the global capital markets and the general macroeconomic environment; new and enhanced product and technology offerings by competitors; push-out of deliveries or cancellation of orders by customers; the ability of KLA's research and development teams to successfully innovate and develop technologies and products that are responsive to customer demands; KLA's ability to successfully manage its costs; market acceptance of KLA's existing and newly issued products; changing customer demands; and industry transitions. For other factors that may cause actual results to differ materially from those projected and anticipated in forward-looking statements in this letter, please refer to KLA Corporation's Annual Report on Form 10-K for the year ended June 30, 2020, and other subsequent filings with the Securities and Exchange Commission (including, but not limited to, the risk factors described therein). KLA Corporation assumes no obligation to, and does not currently intend to, update these forward-looking statements. 2 KLA Non-Confidential | Unrestricted KLA+#3+ + + + + + + + + + + +V¬ + + + + + + + + + + + + + + + + + + + + +_+ + + + + + ++ + + + + + + + + + + + + + + + Global Leader in Electronics Ecosystem KLA#42020: Another Outstanding Year for KLA 1976 KLAH founded Revenue Type 4 KLA Non-Confidential | Unrestricted 57,000 KLAB installed base (tools) Service Systems >10,000 employees US Japan $6.1B Korea مشرا revenue Europe/Israel Rest of Asia Mainland China emel 15% R&D % of revenue Revenue Mix by Geography KLA+#52021: The Secular Story Continues Artificial Intelligence Jul 2020 Oct 2020 WFE Consensus Range Jan 2021 KLA Revenue % increase YoY $B CY20 Apr 2021 5G Connectivity Jul 2020 +30% + 20% + 10% 0% - 10% all BA Oct 2020 5 KLA Non-Confidential | Unrestricted Jan 2021 Apr 2021 May 2020 ▬▬▬ Jul 2020 Virtual Interaction Oct 2020 6% $5.6B Jan 2021 Apr Jul 2021 2020 Aug 2020 ■ 10% $5.8B Mobile Oct 2020 Jan 2021 Apr 2021 Nov 2020 Data Center Jul 2020 14% $6.0B Oct 2020 Jan 2021 Apr Jul Oct 2021 2020 2020 Final 2020 Automotive 16% $6.1 B Jan 2021 Apr 2021 May 2021 I 2021 WFE Mid 20's Jul 2020 Healthcare Oct 2020 Jan Apr 2021 2021 KLA expected to outgrow the market in 2021 KLA+#6Semiconductor Process Control KLA systems find the defects and variations that affect chip performance 6 KLA Non-Confidential | Unrestricted you can't fix what you can't find KLAH you can't control what you can't measure KLA+#7+ + + + + + + + + + + +V¬ + + + + + + + + + + + + + + + + + + + + +_+ + + + + + + + + + + + + ++ + + + + + + + + The "More than Moore" Organization EPC#8The Acquisition of Orbotech and SPTS KLA Completes Acquisition of Orbotech Ltd. February 20, 2019 at 9:15 AM EST KLA+ ⇒orbotech SPTS Anorbotech. Company Specialty Semiconductor Component 8 KLA Non-Confidential | Unrestricted Printed Circuit Board Flat Panel Display ■ ■ February 2019 Extends reach within the electronics value chain Increases exposure to fast growing markets Complements geographic and customer footprints Provides differentiated product portfolio Supports long term revenue and earnings growth targets ■ Installed base utilization creates predictable long term revenue stream KLA+#9Market Expansion Across the Entire Electronics Ecosystem PCB Fabrication and IC Test KLAB PCB 20μm PCB, Substrates Component 9 KLA Non-Confidential | Unrestricted 5μm Assembly and Packaging Advanced Packaging, Advanced Substrate Display Fabrication IC Substrates Panel Level Packaging Flat Panel Display Wafer Level Packaging 2μm 1μm February 2019 Front End Wafer Fabs Specialty Semiconductor Advanced Semiconductor Wafer Fabrication 0.1μm geometry KLA+#10The Creation of EPC Group Ahmad Khan President SEMI PC $ Rick Wallace President and Chief Executive Officer Brian Lorig Executive Vice President GSS 10 KLA Non-Confidential | Unrestricted Oreste Donzella Executive Vice President EPC Indispensable perseverance ■ ■ Honest, Operating KLA# Drive to Be Better Model February 2020 Consistent Forthright, MM ■ Consistent strategy and execution Management by metrics Financial discipline and rigor High Performance Teams KLA+#11The "More than Moore" Organization Log (Functional CPU Scaling) 2008 N28 HKMG 2010 The contribution of lateral scaling through lithography N20 2012 N14 Fin FET 2014 N10 Moore's Law 2016 N7 N5 EUV 0.33NA 2018 2020 Year of 1st Production 11 KLA Non-Confidential | Unrestricted GAA SEMI PC 2022 N3 N2 Vertical Transistor EUV High-NA 2024 Semiconductor Logic Front End Scaling 2026 Moore's Law 1965 "Cramming more components onto integrated circuits" 2028 "Number of transistors is expected to double every 2 years" 3D Logic 2030 GSS Source: imec SOGEA More than Moore UPER Specialty Semiconductor PCB and IC Substrates EPC Packaging BE Display KLA+#12Large and Diversified Customer Base Tier 1 WAFER HOUSES: SUBSTRATE MANUFACTURING Start Ups Shin Etsu ZINGSEMI JRH seitec RPsi siltronic AST SK siltron S-MCO Tier 2 WAFER HOUSES Merchant KINIK (substrate manufacturing) impugrophics HOYA +H.26) MASK SHOPS (reticle manufacturing) PHOTRONICS (Purewafer (532 TOPPAN DNP MASK SHOPS: RETICLE MANUFACTURING Captive tsmc (intel) ESWIN SAMSUNG We SK hynix Micron SMIC Forro Toc WIVER WORKS GCL Blanks Sic SI SiCrystal 4 Wolfspeed AGC Shin EtsuMicroSi HOYA CHIP MANUFACTURING SPC SAMSUNG SIEN MXIC IBM SK hynix SONY Micron HLMC 7 CanSemi intel ST KIOXIA smsc Innotron HTC Pakis στη SMIC SKYWORKS Nexchip Infineon nšiš OSRAM BROADCOM ST IIVI INTEGRATED CIRCUITS FABRICATION Infineon (chip manufacturing) CHIP MANUFACTURING EPC OLEC Powerchip UMC SKYWORKS HMirace go BOSCH Wolfspeed. DEVICES muRata Qualcomm Qorvo win SEMICONDUCTORS SMEC 三安光电 BOSCH WAFER LEVEL PACKAGING SPC AND EPC O SAMSUNG Unimicron ULCSP SUSU SKYWORKS TDK (intel) Amkor CHIPBOND nepee SPIL SFA SEMICON Micron GJCET Powertech business units Union & ChipMOS 9 LB Semicon Skywater WAFER LEVEL PACKAGING KLA+ COMPONENT EPC TFAIRE WALTON RENESAS JO DEVICES intel SK hynix CIPALORE NO Amkor infineon ST GJCET gorvo 1 Micron INSTANTS IBM Powertech SPIL &ChipMOS TOSHIBA COMPONENTS PROCESS GLOBAL SERVICE SUPPORT (GSS) SEMI-PROCESS CONTROL (SPC) ELECTRONICS PACKAGING AND COMPONENTS (EPC) PRINTED CIRCUIT BOARD EPC muRata 团还建科建 Unimicron TIM Technologies dsbj SCCHARD MEKTRON SAMSUNG COMPEG SVE FLEXium ACCESS Career MFLEX MULTEK DAEDUCK KINWONG SUNTAX AT&S CMK Founder PRAH PRINTED CIRCUIT BOARD 金信用 FLAT PANEL DISPLAY חFoxcon FLAT PANEL DISPLAY EPC SAMSUNG BOE HKC L LG AUO MTIANMA END PRODUCTS AUTOMOTIVE (OEMs (Bosch. Continental) and automakers (Ford, Tesla, etc.)) loT, CONSUMER (laptops, watches, smart speakers, VR/AR, security cameras, smart everything...) MOBILE DEVICES phones 5G INFRASTRUCTURE (towers not phones) DATA (data servers (Dell), data centers/cloud (Facebook, Google, Microsoft))#13Global Organization T US 6% 13 KLA Non-Confidential | Unrestricted UK + Europe 26% 2,518 HQ 1+ R & D Israel 25% EPC headcount manufacturing R&D/manufacturing T T ++ Asia 43% KLA+#14+ + + + + + + + + + + +V¬ + + + + + + + + + + + + + + + + + + + + +_+ + + + + + ++ + + + + + + + + + + + + + + + "Everything is Changing" Advanced Packaging#15Semiconductor Technology has been Scaling for 50+ years 1980 g-line (436nm) 1μm 500nm 1990 i-line (365nm) 15 KLA Non-Confidential | Unrestricted KrF (248nm) 250nm 2000 ArF (193nm) 130nm 65nm 2010 ArF Immersion (193i) 32nm ■ 16nm 10nm Conventional Transistor Scaling is still happening, but becoming expensive 2020 7nm EUV (13.5 nm) 5nm 3nm ‒‒‒‒‒‒ ‒‒‒‒‒‒ tA $ ******* KLA+#16Advanced Packaging: Crucial to Semiconductor Technology Roadmap [Lead frame] Wire Leadframe IC Chip (Die) 16 KLA Non-Confidential | Unrestricted Resin Fin 3D PACKAGING: A CATALYST FOR PRODUCT INNOVATION Tovern" is a new 30 technology invented at intel that allows logic chips to be stacked for the first time, helping deliver high compuls density and eating a complete redking of system architecture. Here's a representation of how desca bult in a whole new TOP VIEW SIDE VIEW 3-D INTEGRATION (SYSTEM-IN-PACKAGE) All the benefits of 20 integration plus a new leve of dea a cada anature of systems- Source: Intel G A 8 Compute shpet ------- E F Package H intel) Vision chipset DISCRETE ICS-KEY Tayy Top dies ubump RDL Interposer C4 PCB Substrate BGA From IC Protection to Performance Differentiation smo 3D Fabric SOC Source: tsmc SOC PCB Substrate DRAM Logic HBM TM KLA+#17More Packaging Types | Higher Complexity Time of Flight SIP -DSMBGA Antenna in Package (AIP) =1=k=1== 17 KLA Non-Confidential | Unrestricted In FO-OS Complex Shape SiP QFN- CIS Sensor - PMIC 2.5D-3D Significant Investment Plan to Overcome New Challenges PCB 2.5D ADAS KLA+#18Heterogenous Integration: Scaling while Keeping Cost Down Cost / Transistor ($) Source: AMD Die 2 28nm Fab 2 18 KLA Non-Confidential | Unrestricted Die 1 bonum Fab 1 the 3 14nm Fab 1 Technology Node Ded 40mm Fabd ‒‒‒ IMEMS ??? 1 SoC Approach 2 3 Material & Structure Innovations Heterogeneous Integration Drives Cost/Function Down ■ ■ ■ From System on Chip (SOC) to Chiplets High cost only for core functionalities Disaggregation of the non-core functionalities Heterogenous integration via packaging KLA+#19Hybrid Bonding: The Big Next Inflection in Heterogeneous Integration Logic (memory) ■ Logic Source: tsmc Integration Schemes Logic (memory) b 19 KLA Non-Confidential | Unrestricted Logic (memory) Sensor Logic Logic (memory) HV Thermo-Compression (Bump) Source: tsmc Hybrid (Bump-less) Key Benefits: Speed, Bandwidth and Power Efficiency through increased interconnect density Hybrid Bonding in Packaging with D2W integration key for Al Logic Chips and High Bandwidth Memory Several Inspection, Metrology and Integration Challenges Source: tsmc KLA+#20+ + + + + + + + + + + +V¬ + + + + + + + + + + + + + + + + + + + + +_+ + + + + + + + + + + + + ++ + + + + + + + + Terrific Opportunity for KLA Advanced Packaging#21Advanced Packaging Challenges KLAB 21 KLA Non-Confidential | Unrestricted from Wafer to Packaged IC Components ▪ Heterogeneous Integration Multi-Die Yield ▪ Smaller Features ▪ New Complex Process Steps ■ ▪ Larger Packages and Custom Shapes ▪ Increased Customer Quality Requirements Variety of Applications and Package Types ■ New Materials ■ New Failure Mechanisms and MORE KLA+#22Differentiated Product Portfolio Process Process Control Wafer-Level Packaging SPTS Delta ™M PECVD CIRCLTM-AP wafer SPTS Omega Plasma Etch all-surface inspection 22 KLA Non-Confidential | Unrestricted SPTS Mosaic ™M Plasma Dicing KronosTM 1190 wafer inspection SPTS Sigma PVD Zeta-580 wafer 3D metrology Final Assembly and Test ICOS™TM F160XP wafer/tape inspection, die sort THE RE ICOS TM T3, T7, T8, MV9 tray-tray & tray-tape Inspection, metrology Die Sort Component Sort KLA+#23Advanced Packaging Ecosystem XPU intel. intel. SmC EDUKIDE DODA 2.5D ▪ 3D SoC with cache memory on uP cores for HPC Hybrid bonding for high interconnect density and low power I ULUDA ANCIEN tsmc T ■ Amkor Technology® AMD 23 KLA Non-Confidential | Unrestricted XXILINX ▪ 2.5D interposer-based die partitioning with TSV Competition by TSV-less interposer like RDL or HD-FO ▪ Heterogeneous integration ASE GROUP ▪ 3D-IC DRAM die stacked on logic ▪ HBM demand increasing for Al and data centers Hybrid bonding expected HVM in 2022-23 ■ SAMSUNG ■ intel. ▪ IC substrate scaling to 5/5μm and below ABF roadmap for L/S scaling SK hynix AT&S HBM Micron GILLIES ANON tsmc Unimicron 欣興電子 Substrate KLA+#24Advanced Packaging Key Collaborations HBM Stack Molding Interposer Molding HBM Stack & GPU Underfill kcording macro burre VID CPU-bump Be Die Stacking Process sokern, Ag, Cu) 31 μm has de mizo-lum (Ca) 230μm DRAM Underfill Interposer und PROC induced during cross section DRAM DRAM DRAM DRAM DI DI D DI II 24 KLA Non-Confidential | Unrestricted Defectivity Reduction SiO₂ Al void Cu Crack seam ~0.3μm DOI Metrology and Process Control Dishing Depth Device Height Carrier Height Active Projects with Top5 Semiconductor Companies 15:42 14.58 Cu TEOS Total Height 88 KLA+#25Data Automation and Process Control will Enter Packaging Fabs Process Control KLA 2135 Coat Expose Etch Inspect and Measure 25 KLA Non-Confidential | Unrestricted Clean KIR Fill KLA CMP Introduced in frontend in mid 90's From Defect... Analyze Browser Cluster Analysis DSA SSA Zonal Analysis Repeater Analysis SPC Review Sampling ∞ W Correlate Monitor Water Lookup DBR 126 DBB RSDSA 88888 WIP Commonality Analysis FOO Metrology KPC++ Unpatterned to Patterned Correlation Hotspot Discovery Reticle Inspection Lot History Metrology to Defect Yield Prediction Unique Opportunity for KLA to Implement Semiconductor Frontend BKMs Identify Killer Defect? Problematic Chamber/ Process? *********** KLA+#26+ + + + + + + + + + + +V¬ + + + + + + + + + + + + + + + + + + + + +_+ + + + + + ++ + + + + + + + + + + + + + + + New Growth Engine for KLA Advanced Packaging#27Packaging: New Growth Engine for KLA KLA Revenue in Packaging 2015 2016 New Products Adoption 27 KLA Non-Confidential | Unrestricted 2017 Zeta Acquisition 2018 2019 ORBOTECH/ SPTS Acquisition New Products Adoption 2020 Share Gain 2021 F Share Gain New Products Adoption >20% CAGR (2019-23) via Organic Growth and Acquisitions 2022 F Share Gain 2023 F Share Gain New Products Adoption KLA+#28AA + + + + + + + + Oreste Donzella, Executive Vice President EPC Group + + + + + + + + + KLA+ Thank You + + + + + + + + + June 16, 2021