Investor Presentaiton

Advanced Packaging Solutions with Lithography Market Drivers ■ Artificial Intelligence ■ Automotive Mobility Graphical Processing Units AP300 Necco The Veeco Difference Veeco's Advanced Packaging Lithography is the process of choice: ■ Fan-out wafer level packaging at top foundries and OSATS ■ Copper Pillar applications in high bandwidth memory Updated Product Platform: ■ Highly automated Improved performance ■ Cost effective Enabling Better System Performance Smaller Form Factor Lower Cost Higher Performance 12 Investor Presentation | 2021 Veeco Instruments Inc. OSAT - Outsourced Assembly and Test Provider Improved Battery Life Veeco

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