Himax Company Overview

Fabless Manufacturing Expertise Display Driver Wafer Fabrication 力積電 SK hynix systemic MX Nexchip I-NEC UMC SMIC tsmc VIS V MXIC LISTED NYSE GLOBALFOUNDRIES CMOS Image Sensor Back-end Package Xintec KINGPAK® COILCSP MINIATURIZATION PROCESS Himax Chip Probe Testing KYEC CHIPBOND Chipbond Technology Corporation. CHIPMORE Processed Tape CHIPBOND Chipbond Technology Corporation. STEMCO LG Innotek JAC 易華電子股份有限公司 JMC ELECTRONICS CO.,LTD. Gold Bumping LB Semicon ChipMOS CHIPBOND USC UNION SEMICON networks ↓ FT Vate RW th KINGPAKⓇ CHIPBOND Chip Probe Testing 096 UNION SEMICON LBSemicon KYEC Chipbond Technology Corporation. CHIPMORE ChipMOS Micro Silicon YTEC Assembly and Testing CLUSEM ChipMOS LBLusem netes USC UNION SEMICON YTEC Chipbond Technology Corporation. CHIPMORE Chip Probe Testing SOC KYEC Global Testing Corporation 寰邦科技股份有限公司解超豐電子股份有限公司 US Silicon 微電子 GREATEK ELECTRONICS INC. FT 范圍矽格股份有限公司 SIGURD MICROELECTRONICS.CO C长电科技 CHANGJIANG ELEC.TECH. OSE A partner you can count 何超豐電子股份有限公司 "GREATEK ELECTRONICS INC. ASE GROUP KYEC Global Testing Corporation 寰邦科技股份有限公司 Ardentec 欣銓科技 OSE Package A partner you can count 台灣典範半導體 wan IC Packaging Corporation C长电科技 CHANGJIANG ELEC.TECH. 【超豐電子股份有限公司 "GREATEK ELECTRONICS INC. ASE GROUP 17

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