ASMPT Advanced Packaging Solutions

Advanced Packaging Highlights Positioned Well for Generative Al and HPC Growth 1H 2023 Group Revenue US$998M Thermo-Compression Bonding (TCB): Advanced Packaging -19% . • Highest contribution to AP revenue Logic: Key enablers of C2W and C2S processes ASMPT digital world Memory: Fulfil demanding requirements for next-gen HBM, won repeat HBM orders Mass Reflow High Precision Die-bonding: Continuous order from top global customers Hybrid Bonding: Engagement in various end-market applications, including memory Other solutions benefitting from generative Al demand: Silicon photonics, laser singulation, panel ECD and SMT placement tools Physical Electro- Chemical Deposition Vapor Deposition (Wafer/ Panel Level Plating) * Laser Singulation * Wafer/ Panel Level Fan Out* Ultra Precision Die Bonding Mass Transfer & Bonding (Advanced (Silicon Photonics) * Displays) Multi-Chip Module Bonding Thermo Compression Bonding SMT Hybrid Bonding * Flip Chip Wafer Level Fan In SiP Placement Apollo Series Stratus Series Conductor Laser 1205 NUCLEUS NANO AD300 Vortex II Series VECTOR FIREBIRD Lithobolt AD8312FC SUNBIRD SIPLACE TX Micron Comprehensive Range of Advanced Packaging Solutions Advanced packaging solutions for generative Al and HPC 5

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