ASMPT Advanced Packaging Solutions

Key Investor Takeaways Unique Broad-based Portfolio ASMPT digital world Strong Tailwinds Long-Term Secular Growth Drivers (5G/AI/Advanced Displays / Automotive/HPC/loT) Addressable Market Expansion Advanced Packaging: US$2.5B (2027) (23-27F CAGR: ~13%) 1 Automotive: US$2.9B (2027) (23-27F CAGR: ~10%)¹ Unique Broad-based Portfolio Mainstream & Applicative Tools Volume Leverage + Cash Generators Mainstream Die & Wire Bonders, Test Handlers and Encapsulation tools Mainstream SMT Printing and Placement Applicative Camera Module, Lens Attach and Active Alignment Advanced Packaging Tools High Growth + High Margin Mid-End Deposition and Laser Singulation Ultra-Precision Placement Mini/Micro LED, TCB and Hybrid Bonding System-in-Package Die Bonder and SMT Placement Long-Term Performance Less Cyclical Revenue and Profitability Structural Revenue Growth and Margin Expansion Bullish Growth of Global Semiconductor Device Market US$ 990.31B (2028) (23-28F: CAGR: 8.03%)² 1 Company Management's Estimates (Last updated in Q4 2022) 2 Mordor Intelligence Software Solutions for Smart Manufacturing 20 20

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