Investor Update 9M2022
Mid- to long-term outlook is bright, with advanced packaging growing
from 40% in 2020 to more than 60% in 2030
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2021 vs. 2030 Market by
Device Type (US$B)
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1 Fundamental trends favor Test 2.0
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Advanced packaging forecasted to make up more than 60% of the packaging
market by 2030, from 40% in 2020 (Source: The Insight Partners)
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Logic device revenue expected to double from US$248B to US$508B
900
800
231
700
600
510
500
23
508
400
166
300
200
248
100
165
74
0
2021
2030
Analog
Logic
Memory
I MCU / DSP
(Source: IC Insights)
AEM | Investor Update 9M2022
ΛΕΜ
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Intel's process roadmap is aimed at obtaining process performance parity in
2024 and leadership in 2025 via Ribbon FET, PowerVia, Foveros Omni and
Foveros Direct, and eventually Intel's 20A process node (Source: AnandTech.com)
The West is expected to increase investments with a large part of assembly
and test concentrated in SEA (Source: AEM analysis)
2 Consensus view that semiconductor market will grow to $1tn by early
2030s
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Compute / Al, Automotive, data storage, and wireless are the key segments
driving growth (Source: McKinsey & Co, IC Insights)
Short-term geopolitical uncertainty may slow down China's growth temporarily,
but should drive increased investment in the West (Source: AEM Analysis)
3 300mm fab capacity to grow at a 10% CAGR from 2022 to 2025, with
9.2 million wafer per month
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Investments in new fabs / lines (~67) are expected to start between 2022 and 2025
(Source: SEMI.org)
Back-end capacity has not yet seen an increase to accommodate front-end
production increases (Source: SEMI.org)
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