Investor Presentaiton

Addressing the limitations of scaling SAM = served available market LAM RESEARCH BEOL = back end of the line Backside power delivery Close to $1B incremental SAM opportunity for every 100K monthly wafer starts Power interconnects increasingly compete for space in BEOL and at the transistor level Technology enables separation of the signal and power delivery paths; new etch and deposition capabilities are needed Have tool of record positions at a leading foundry/logic customer

View entire presentation