AMD Investor Presentation Deck

23 3RD Gen AMD EPYC™ Processor with TM AMD 3D V-Cache ™M Technology The first Data Center x86 CPU with true 3D Die Stacking AMD CORPORATE PRESENTATION | MAY 2022 Deliver 3X the L3 cache* for breakthrough per-core performance Same features and capabilities as 3rd Gen AMD EPYC processors TM Um co m mm me mm -m s AMD EPYC IIIII! HUILE H 11 1 11 74 1 2 m A wm Partner solutions expected from Atos, Cisco, Dell Technologies, Gigabyte, HPE, Lenovo, QCT and Supermicro * Versus standard 3rd Gen EPYC processors. See endnotes MLNX-012 AMD

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