Market Trends, Materials & Manufacturing Processes
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PV 3. Crystalline Silicon Solar Cells
Low Temperature Process
Silicon Heterojunction
Aluminium Back Surface Field
(Al-BSF)
Front metal grid
ARC (SIN)
(p) c-Si
ΑΙ
Passivated Emitter and Rear Contact
(PERC)
Front TCO
(SHJ)
Front metal grid
- i/p a-Si:H
(n) c-Si
<i/n a-Si:H
Front metal grid
ARC (SiNX)
Rear TCO
Rear metal grid
SiOX
n* emitter
(p) c-Si
BSF
- SiO2 or Al2O3
ΑΙ
SiNX
100%
90%
80%
70%
60%
50%
40%
World market share [%]
IHS Markit data
ITRPV 2022
High Temperature Process
High Temperature Passivating Contact
(HTPC)
Front metal grid
ARC (SiNX)
(p) c-Si
ΑΙ
Siox
n* emitter
SiO2
p+ polysilicon
EPFL
30%
Siox
20%
n* emitter
10%
0%
IHSM 2021 2021
2022
2024
2026
2029
2032
BSF
PERC/PERL/PERT/TOPCon
BSF
Si-heterojunction (SHJ)
Si-based tandem
back contact (incl. metal wrap through)
GoPV Project | SUMMER SCHOOL
PV SYSTEMS TECHNOLOGIES AND DESIGN
9
ITRPV (2022)View entire presentation