Onto Innovation Investor Presentation
Onto Growth Driver: Advanced Packaging (Wafer Drivers)
High Performance Compute, Intelligent Edge, AI, Mobility
INTERCONNECTS SHRINK IN SIZE
AND INCREASE IN DENSITY >200M
BUMPS PER WAFER
Hybrid
Bonding
Cu μPillar
Cu μPillar
50 μm
400 1/0
30 μη
1,000 1/0
Cu μPillar
20 μη
2,500 1/0
Cu μPillar
10 μm
10,000 1/0
250
200
Bump I/O Count (Millions)
100
100
150
SCALING DRIVEN BY
TOP 5 IDMS
AP Technology Scaling
20
20
18
16
14
12
10
8
Redistribution Metal Layers
IDM ADVANCED PACKAGING
INSPECTION MARKET SHARE
ONTO Market Share:
Top5 IDMs1
TOP 5
IDM'S
Others
HBM
LSI
Source: TSMC COWOS-L Heterogeneous Integration Cross-Section
Package Example, June 2021
11
50
2
0
0
2018
2020
2022
Bump Count (M)
Redistribution Layers
Note 1: Onto Management Estimates
Source: TechSearch International, December 2021
innovationTM
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