ASMPT Advanced Packaging Solutions

Advanced Packaging Interconnects by TCB = 54 Example of a High-end HPC device using both TCB & Hybrid Bonding Memory stacking (A) 48 interconnects (4 x 12 = 48) Bonding to Passive Interposer 5 interconnects 4(A) + 1(B) = 5 Compound die to HDI substrate 1 interconnect (1 x 1 = 1) 1x Memory, 12x stacks (A) 1x Memory, 12x stacks (A) 3D Integrated IC with 6 Chiplets (B) Compound die to HDI substrate 1x Memory, 12x stacks (A) 1x Memory, 12x stacks (A) ASMPT digital world Interconnects by HB = 6 Chiplet integration to Active Interposer (B) 6 interconnects (6 x 1 = 6) Passive interposer Active interposer -HDI Substrate In this example, interconnects handled by TCB-9x those handled by HB 24

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