nLIGHT Corporate Overview

Interconnects PCB drilling, cutting, additive manufacturing and routing Display Touch patterning, lift-off, backplane crystallization Wafer Processing Scribing, dicing, and marking of wafers Component Test Multi-layer ceramic capacitors Flex Circuits Trimming, via hole drilling 0 Enclosure Marking, micro-hole drilling, cutting, frit sealing Microfabrication nLIGHT lasers enable new consumer electronics Circuit Trim Wafer & circuit resist trimming Cutting Glass, Sapphire, metal Note: illustrative application does not imply or constitute endorsement.

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