Himax Company Overview
Recognized Industry Leader
Himax
For the last 30 years, we have worked with leading OEMs to develop and the most recognized
imaging and human interfacing technologies.
1990s
Founder B.S. Wu pioneers flat
panel technologies at Chimei
Electronics as CTO
2000s
Chairman Wu establishes Himax to meet
DDIC demand for large panels and fast-
growing medium and small panels
2010s
Himax gains market share with design
wins with leading technology products
companies, worldwide
2018 and Beyond
Himax leads WLO shipment and development with North
American OEM customer, 3D sensing for Android. LCOS
advancements for AR & HUD, CMOS for Notebook, and WLO
integration keep Himax at the forefront of AR/VR product
design and pending product releases.
Corporate Timeline
June 2001
Himax Taiwan formed
by B.S. Wu
October 2004
Forms Himax Display to focus on
LCOS microdisplay technology
March 2006
Himax IPOs on Nasdaq.
Raises $147M with Morgan
Stanley
9:09
September 2015
US customer
August 2016
Start expansion for
next generation
LCOS and WLO
production lines
2H2018
Industry first ASC 3D sensing
reference design with
MediaTek and Megvii. TDDI
ramp with smartphone OEMs.
WLO shipment
2020
Expect strong growth from all
products include LDDIC,
TDDI for Smartphone and
Tablets, Auto, 3D sensing
and CMOS, start OLED
product shipment
2009
GFC reduces sales -$900 million to ~$700
million. Refocuses effort on non-driver products
June 2013
Himax completes take out
financing of Chimei
AR business hits inflection
point with pilot production
shipment made to a major
2001 2002 2003 2004 2005
2006
2007
2008 2009
2010
2011 2012
2013 2014
2015
2016
2017
2018
2019
2020
August 2005
December 2003
Himax Taiwan begins
trading on Emerging Stock
Board (TW) under "3222"
Himax Taiwan delists from
Emerging Stock Board
February 2007
Himax acquired Wisepal, and forms
Himax Semiconductor to focus on small
and medium sized DDICS
2010 2012
Non-driver sales increase gross margins and
BOM sales opportunities
-
2016
2017
July 2013
Signs investment
agreement with
Google
Mass production and
shipment of AR related
LCOS and WLO,
AMOLED DDIC, and
in-cell TDDI
Qualcomm and Himax
jointly announced
structured light-based 3D
depth sensing solution
2019
TDDI for smartphone
and WLO are the
growth driver
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