Investor Presentaiton
Efficient Design Implementation for Multi-Die Systems
UNIFIED EXPLORATION-TO-SIGNOFF
3DIC COMPILER
Exploration &
Creation
Implementation
System Signoff
Common Fusion Data-model
Complete architecture-
to-signoff solution in a
consolidated user
environment
End-to-end solution for
efficient, 2.5D, and 3D multi-
die system integration
DIE-TO-DIE IP
UCle Die-to-Die IP
PHY
Controller
Delivers up to 4Tbps
bandwidth in a multi-
module configuration
Security
Verification IP
Enables ultra-low latency
link between two dies
Scalable
100s of billions of
transistors
Productive
Fast exploration &
design
Golden
Signoff
Convergence to
optimal PPA/mm³
Complete
PHY, Controller,
VIP
Secure
Opt. Authentication
Engine
synopsys®
Robust
Based on Proven IP
2023 Synopsys, Inc.
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