Micron Investor Day 2022

232-layer: The world's most advanced NAND Industry leadership sustained – starting ramp in late CY22 1Tb TLC NAND *CUA: CMOS Under Array ■ ☐ ☐ ☐ Extending CuA and 2 array stack process architecture Optimized for leadership in managed NAND and SSD Combination of external and optimized internal controllers Increased density, power and bandwidth node-over-node 232 Layer, 2 stack, CuA* NAND 56 Micron

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