Himax Company Overview
GROWTH OPPORTUNITY 2.2
WLO and 3D Sensing
Market Trends
9:00
Wafer-Level Optics (WLO) remains the best technology for structured light, Time-of-
Flight (TOF) active stereo camera (ASC) and 3D sensing
Very few companies can provide advanced WLO solutions to achieve optical high
efficiency, small form factors, and eye safety regulations for consumer devices
3D sensing adoption is expected to be wider for Android smartphones and AloT
starting 2019 and beyond.
Himax Strategies and Market Position
WLO: Exceptional design know-how and mass production expertise deliver
consistent product quality and high yields for WLO anchor customer's large-scale
adoption since 2017 with ongoing shipment in 2020. Expect multiple design wins of
new content with higher ASP in 2H20
Himax continue to participate in most ongoing 3D sensing projects covering
structured light for non-smartphone application and time-of-flight (TOF) for
smartphone 3D, focusing on transmitter module by leveraging our WLO related
expertise
WLO 3D sensing projector in ToF WF module for Android smartphone will be the
largest new growth opportunity for Himax moving forward. Target reference design
ready 1Q20. Potential shipment opportunity with multiple Tier-1 OEMs in 2020,
higher ASP than WLO
3D Sensing for non-smartphone, working with industry-leading facial recognition
algorithm and application processor partners to develop new 3D sensing application
for smart door lock with design-in projects already underway with certain end
customers
WLO and 3D Sensing will be the largest growth opportunity for Himax beyond 2020
Himax WLO for 3D Sensing
DOE for Structured
Light (30k)
DOE for Active
Stereo (6k 14k)
Wafer Level Process
Integrated Optics
High Accuracy
Scalability In Production
Himax
Flood for ToF and
Structured Light
Mini Package
Ultra Small Size & Package
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