GlobalFoundries Investor Presentation Deck
Differentiated technology platforms
Feature-Rich
CMOS
Complementary
Metal-Oxide
Semiconductor
Mixed-Technologies
for Power
Management,
High-Voltage,
Embedded Memory
>3 billion high-end audio
amp units (BCDLite)
shipped
>150K DDIC wafers
shipped
FinFET
Fin Field-Effect
Transistor
High Performance,
Power Efficient
"Systems-on-a-Chip"
Scarce capacity - GF
one of three foundries
and adding unique
features
FDX™M
Fully-Depleted
SOI
Enabling New High-
Performance, Low-
Power Applications
Supports two of top
three 5G mmWave FEM
design companies
O
RF SOI
RF
Silicon-on-Insulator
Low Power/Low
Noise/Low
Latency/High
Frequencies
1st fully qualified high-
volume RF SOI Foundry
solution on 300mm
wafers
Fxxx
SiGe
Silicon
Germanium
Power Amplifier and
Very High Frequency
Applications
Highest fmax SiGe
BiCMOS foundry
process in volume
production at 400GHz
with roadmap to 1THz
SiPh
Silicon
Photonics
Higher Data Rates with
Greater Power
Efficiency
5-10x better power
efficiency than long
range electrical
interconnect
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