GlobalFoundries Investor Day Presentation Deck slide image

GlobalFoundries Investor Day Presentation Deck

Lower Power: Ultimate Feature Feature-Rich CMOS 55nm ULP 40nm 28nm FinFET 12LP+ ULP HDLV FDX™M FD-SOI 22FDX ULL/ULP 22FDX+ ULL/ULP 12FDX ULL/ULP ((())) RF SOI 180nm 7SW LNA SW PA NSX NSX-Gen2 8SW LNA SW Low latency LNA EDMOS PA 9SW 90nm 45RFSOI 45nm SiPh 90nm 90WG 250μm pitch Fiber Array attach High Power Wave Guides 45CL0 127um pitch Fiber Attach TSV On-Die Laser Micro-ring Modulators Custom Production Platform Features Development Platform Features 45SP3 45SPQ ☐ ☐ Extending our ultra-low power w/ 22FDX+: >20% power reduction Vdd 0.8V 0.65V 0.5V 22FDX 22FDX+ Increase % 450Mhz 550MHz 22% 250MHz 300MHz 20% 100MHz 150MHz 50% 45CLO: <1pJ/ bit for data transmission Photonics ASIC Core (Client IP) VSR or XSR SERDES (all sides) - Transceivers in photonics ~10X lower power - 30% system power reduction GlobalFoundries © 2022 All Rights Reserved 61
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