Q1 FY2024 Consolidated Financial Summary

Q1 FY2024 Business Progress Net sales and profit both tracking to plan - - Net sales 391.7B yen, Operating income 82.4B yen, Net income 64.3B yen ACL Mask ON Memory Channel Hole 10um Etch Time 32.8 min ON E/R Max CD Btm CD 353 nm/min 114 nm 76 nm AMax-Btm 38 nm Hole Bottom cut by FIB Source: The Japan Society of Applied Physics Steady progress on key themes of Medium-term Management Plan Announced new etching technology for 400-layer level 3D NAND Channel Hole application • Achieved significant increase in dielectric etching rate at cryogenic temperature Reduces global warming potential by 84% compared to previous method - Adoption of wafer bonding technology has accelerated • Significant increase in inquiries for DRAM HBM* Development and evaluation also progressing in 3D NAND and leading-edge logic *HBM: High Bandwidth Memory Investor Relations / August 10, 2023 Cryogenic Process Straighter, deeper and faster High Aspect Ratio Etching Plasma Control Deep learning optimization Beyond 10 μm 2.5x Faster Environmental Performance Low environmental load -43% Less Power -84% Less Carbon Footprint TEL 60 Source: TEL TEL 14

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