Investor Presentaiton

Business Opportunities and Focus Areas by FY2025 Logic DRAM NAND Image of device Requirements Low-power/high-speed CPU High-speed Working Mem. (DDR5) Technological changes ■ GAA Nanosheet Backside PDN*1 Business opportunities Selective etch Deposition with new materials Supercritical drying Bonding/ laser edge trimming ■ EUV HKMG*2 CMOS peripheral circuits ■ Coater/Developer for EUV Deposition with new materials Supercritical drying High-capacity storage ■ Multi-layer / tier stacking Peripheral bonding ■ Introduction of new materials for memory cells ■ HARC etch Wet etch, new drying technology ■ New low-resistance metal ■ Bonding ■ Wafer warpage suppression technology CORP IR / May 11, 2023 Growth opportunities are ever-expanding *1 Backside PDN (Power delivery network): Design to provide power supply and reference voltage effectively to active devices *2 HKMG (High-k metal gate): Transistors which have metal gates with high dielectric constant materials TEL 17

View entire presentation