Investor Presentaiton

We Support the Industry Roadmap Copper interconnects transition to 5um pitch Bump sizes and pitches are decreasing Number of bumps per die is increasing RDL line and space are shrinking Camtek See Beyond Hybrid bonding technology moves down to 1um pad size Roadmaps in heterogenous integration are moving to more chip- chip stacking by hybrid bonding Cu Pillar Cu Pillar 20um Cu Pillar 10um Cu Pillar 5um 30um 1,000 1/0 mm² 2,500 1/0 mm² 10,000 1/0 mm² 40,000 1/0 mm² High volume manufacturing Copyright of Camtek Ltd 2023. All rights reserved Next generation 10 Back Side Metal DRAM Memory Al Logic Die Memory Controller Die DRAM Memory Memory Controller Die Silicon Interposer Advanced Substrate Source: Applied Materials, Inc. 1: 12

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