Market Trends, Materials & Manufacturing Processes
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PV 3. Crystalline Silicon Solar Cells
Low Temperature Process
Silicon Heterojunction
Front TCO
(SHJ)
Front metal grid
- i/p a-Si:H
(n) c-Si
<i/n a-Si:H
EPFL
Aluminium Back Surface Field
(Al-BSF)
Front metal grid
(p) c-Si
ΑΙ
ARC (SIN)
SiOx
n* emitter
BSF
Challenges:
→
Optical losses reflection of
photons at rear surface
Recombination losses → at
metallic contact
Ohmic losses → high series.
resistance at interfaces
Rear TCO
Rear metal grid
Advantages:
Better passivation
↓ Processing temperature
Thickness, ↓ cost
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↑ Open-circuit voltage (Voc)
Temperature coefficient
Challenges:
Need of ECA for soldering
adhesion fingers/TCO
ECA: electrically conductive adhesive
GoPV Project | SUMMER SCHOOL 11
PV SYSTEMS TECHNOLOGIES AND DESIGN
TCO: transparent conductive oxideView entire presentation