KLA Investor Conference Presentation Deck

Hybrid Bonding: The Big Next Inflection in Heterogeneous Integration Logic (memory) ■ Logic Source: tsmc Integration Schemes Logic (memory) b 19 KLA Non-Confidential | Unrestricted Logic (memory) Sensor Logic Logic (memory) HV Thermo-Compression (Bump) Source: tsmc Hybrid (Bump-less) Key Benefits: Speed, Bandwidth and Power Efficiency through increased interconnect density Hybrid Bonding in Packaging with D2W integration key for Al Logic Chips and High Bandwidth Memory Several Inspection, Metrology and Integration Challenges Source: tsmc KLA+

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