KLA Investor Conference Presentation Deck
Large and Diversified Customer Base
Tier 1
WAFER HOUSES:
SUBSTRATE MANUFACTURING
Start Ups
Shin Etsu ZINGSEMI JRH
seitec RPsi
siltronic AST
SK siltron
S-MCO
Tier 2
WAFER
HOUSES
Merchant
KINIK
(substrate manufacturing)
impugrophics
HOYA
+H.26)
MASK
SHOPS
(reticle manufacturing)
PHOTRONICS
(Purewafer
(532
TOPPAN
DNP
MASK SHOPS:
RETICLE MANUFACTURING
Captive
tsmc (intel)
ESWIN
SAMSUNG
We
SK hynix
Micron
SMIC
Forro Toc
WIVER WORKS
GCL
Blanks
Sic
SI
SiCrystal
4
Wolfspeed
AGC
Shin EtsuMicroSi
HOYA
CHIP MANUFACTURING SPC
SAMSUNG SIEN MXIC
IBM SK hynix SONY
Micron HLMC 7
CanSemi
intel ST
KIOXIA
smsc
Innotron
HTC
Pakis
στη
SMIC
SKYWORKS
Nexchip
Infineon nšiš
OSRAM
BROADCOM
ST IIVI
INTEGRATED
CIRCUITS
FABRICATION
Infineon
(chip manufacturing)
CHIP MANUFACTURING EPC
OLEC
Powerchip
UMC
SKYWORKS
HMirace go
BOSCH
Wolfspeed.
DEVICES
muRata
Qualcomm Qorvo
win
SEMICONDUCTORS
SMEC
三安光电
BOSCH
WAFER LEVEL PACKAGING
SPC AND EPC
O
SAMSUNG
Unimicron
ULCSP
SUSU
SKYWORKS
TDK
(intel)
Amkor
CHIPBOND
nepee SPIL
SFA SEMICON
Micron
GJCET
Powertech
business units
Union
& ChipMOS
9
LB Semicon
Skywater
WAFER LEVEL
PACKAGING
KLA+
COMPONENT EPC
TFAIRE
WALTON
RENESAS
JO DEVICES
intel
SK hynix CIPALORE NO
Amkor infineon
ST GJCET
gorvo
1
Micron
INSTANTS
IBM
Powertech SPIL
&ChipMOS
TOSHIBA
COMPONENTS
PROCESS
GLOBAL SERVICE SUPPORT (GSS)
SEMI-PROCESS CONTROL (SPC)
ELECTRONICS PACKAGING AND COMPONENTS (EPC)
PRINTED CIRCUIT BOARD EPC
muRata
团还建科建
Unimicron
TIM Technologies dsbj
SCCHARD
MEKTRON
SAMSUNG
COMPEG
SVE FLEXium
ACCESS
Career
MFLEX
MULTEK
DAEDUCK
KINWONG
SUNTAX
AT&S
CMK Founder
PRAH
PRINTED CIRCUIT
BOARD
金信用
FLAT PANEL
DISPLAY
חFoxcon
FLAT PANEL DISPLAY EPC
SAMSUNG
BOE HKC L
LG AUO
MTIANMA
END PRODUCTS
AUTOMOTIVE
(OEMs (Bosch.
Continental)
and automakers
(Ford, Tesla, etc.))
loT, CONSUMER
(laptops, watches,
smart speakers,
VR/AR, security
cameras, smart
everything...)
MOBILE
DEVICES
phones
5G
INFRASTRUCTURE
(towers not phones)
DATA
(data servers (Dell),
data centers/cloud
(Facebook, Google,
Microsoft))View entire presentation