AMD Investor Presentation Deck

17 AMD Leadership Packaging Innovation 2015 2.5D HBM AMD 2017 AMD CORPORATE PRESENTATION | MAY 2022 Multichip Module Led Industry in HBM, 2.5D & Chiplet Architecture 2019 Chiplets NEWAGWE MEERWE BEING NO 2021 3D Chiplets (Chiplet + Advanced 3D Stacking) ONOGRA Aggressive Roadmap for Chiplet & 3D Integration AMD

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