KLA Investor Conference Presentation Deck

Advanced Packaging Challenges KLAB 21 KLA Non-Confidential | Unrestricted from Wafer to Packaged IC Components ▪ Heterogeneous Integration Multi-Die Yield ▪ Smaller Features ▪ New Complex Process Steps ■ ▪ Larger Packages and Custom Shapes ▪ Increased Customer Quality Requirements Variety of Applications and Package Types ■ New Materials ■ New Failure Mechanisms and MORE KLA+

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