GlobalFoundries Investor Day Presentation Deck

Global Manufacturing Footprint - Current Manufacturing Strategy 4000 *** Asset Sale Transfer End of 2022 Note: 1. Kwpa is defined as 2022 capacity in thousand wafers per annum 2. 200mm capacity translated to 300mm equivalent ****** Capital efficient expansion through public-private partnerships Dual technology qualification provides flexibility and supply security Global Centers of Excellence enhance operational scale Malta, NY, USA 300mm Singapore 300mm & 200mm Dresden, Germany 300mm Burlington, VT, USA 200mm East Fishkill, NY, USA 300mm Capacity: 400 kwpa Technology: FinFet, NVM, RFSOI, SiPho Capacity: 730 & 370 kwpa Technology: BCD/BCDL, HV, NVM, DDI, RFSOI, LP SiGe Capacity: 680 kwpa Technology: FDX™, NVM, HV, BCDL Capacity: 250 kwpa Technology: RFSOI, SiGe, GaN Capacity: 150 kwpa Technology: HP CMOS, RFSOI GlobalFoundries © 2022 All Rights Reserved 85

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