NVIDIA Investor Presentation Deck

Microbump Bump Ball DRA M HBM S ●●● GPU GPU OE TSMC Interposer HBM S Organic Package PCB EIC Co-packaged Photonics Optical Engine (OE) PIC ●●●● O PIC EIC OE OE OE Switch Organic Package PCB OE OE OE Switch 24 NVLINKS 4.8Tbps per Direction 24 Laser Fibers 24 TX Fibers 24 RX Fibers ~5mm x ~10mm

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