GlobalFoundries Investor Day Presentation Deck slide image

GlobalFoundries Investor Day Presentation Deck

Global Manufacturing Footprint - Beyond '23 Manufacturing Strategy ******* 100000 Gateway 3 4000 Note: 1. Kwpa is defined as 2022 capacity in thousand wafers per annum 2. 200mm capacity translated to 300mm equivalent COOO ***** 000 Total capacity increases >50% from 2020 to 2025 Capital efficient expansion through public-private partnerships Dual technology qualification provides flexibility and supply security Global Centers of Excellence enhance operational scale Malta, NY, USA 300mm Singapore 300mm & 200mm Dresden, Germany 300mm Burlington, VT, USA 200mm Crolles, France 300mm Capacity: 570 kwpa Technology: FinFet, NVM, RFSOI, SiPho Capacity: 1,200 kwpa & 370 kwpa Technology: BCD/BCDL, HV, NVM, DDI, RFSOI, LP SiGe Capacity: 850 kwpa Technology: FDX™M, NVM, HV, BCDL Capacity: 280 kwpa Technology: RFSOI, SiGe, GaN Capacity: 360 kwpa Technology: 22 FDX GlobalFoundries © 2022 All Rights Reserved 86
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