KLA Investor Conference Presentation Deck

Heterogenous Integration: Scaling while Keeping Cost Down Cost / Transistor ($) Source: AMD Die 2 28nm Fab 2 18 KLA Non-Confidential | Unrestricted Die 1 bonum Fab 1 the 3 14nm Fab 1 Technology Node Ded 40mm Fabd ‒‒‒ IMEMS ??? 1 SoC Approach 2 3 Material & Structure Innovations Heterogeneous Integration Drives Cost/Function Down ■ ■ ■ From System on Chip (SOC) to Chiplets High cost only for core functionalities Disaggregation of the non-core functionalities Heterogenous integration via packaging KLA+

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