Investor Presentaiton
Core Platform Technologies
Molding Packaging
I
|
High-precision
Optical Assembly
High-precision Actuating
Advantage:
Module height reduction > 0.37mm, XY inner
shrinkage > 0.8mm compared with normal COB
packaging;
②30% module dimension reduction on the AR
light engine packaging, more suitable for XR
application
Sunny Capability:
1 Continuing MP for large sensor tele modules
Developed MOC IV, the first innovative industry
technology for chip w/ flip bonding process
③Developed ultra-thin side wall packaging w/
wafer level manufacturing design to satisfy XR
module size requirement.
Advantage:
Multiple optics alignment at sub-micron level
with contemporary adjustment of the key
optical performance indicators including Peak,
Tilt, FC etc.; breakthroughs of the optical
system's assembly tolerance, and enable the
MP of complex optical systems of camera
module
Sunny Capability:
① MP of Lens-element focus, G+P hybrid lens etc.
2 MP of 1/1" and other extremely large sensor;
3 MP of Fno1.4 and other larger aperture;
lens of large aperture
4 Delivered the miniaturized color Micro LED light ④ Developed tele camera with multiple groups
engine with 0.4cc. Developed 0.35cc
monochromatic AR light engine.
Advantage:
Integrated design of Actuator-Lens-Module to
enable smaller size, better performance, less
component, competitive cost etc., boosting the
continuous innovation of module design &
manufacturing.
Sunny Capability:
Integrated design capability of optical,
mechanical and electronic systems;
Over 355 patents, MP for OIS actuator,
successfully developed variable aperture and AF
w/ long stroke, sensor shift OIS is under
development
③Highly integrated full-automated assembly line
applied for MP.
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