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Investor Presentaiton

Core Platform Technologies Molding Packaging I | High-precision Optical Assembly High-precision Actuating Advantage: Module height reduction > 0.37mm, XY inner shrinkage > 0.8mm compared with normal COB packaging; ②30% module dimension reduction on the AR light engine packaging, more suitable for XR application Sunny Capability: 1 Continuing MP for large sensor tele modules Developed MOC IV, the first innovative industry technology for chip w/ flip bonding process ③Developed ultra-thin side wall packaging w/ wafer level manufacturing design to satisfy XR module size requirement. Advantage: Multiple optics alignment at sub-micron level with contemporary adjustment of the key optical performance indicators including Peak, Tilt, FC etc.; breakthroughs of the optical system's assembly tolerance, and enable the MP of complex optical systems of camera module Sunny Capability: ① MP of Lens-element focus, G+P hybrid lens etc. 2 MP of 1/1" and other extremely large sensor; 3 MP of Fno1.4 and other larger aperture; lens of large aperture 4 Delivered the miniaturized color Micro LED light ④ Developed tele camera with multiple groups engine with 0.4cc. Developed 0.35cc monochromatic AR light engine. Advantage: Integrated design of Actuator-Lens-Module to enable smaller size, better performance, less component, competitive cost etc., boosting the continuous innovation of module design & manufacturing. Sunny Capability: Integrated design capability of optical, mechanical and electronic systems; Over 355 patents, MP for OIS actuator, successfully developed variable aperture and AF w/ long stroke, sensor shift OIS is under development ③Highly integrated full-automated assembly line applied for MP. 48
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