Market-Defining and Diversified Innovations Driving Value Creation
Enabling Future Digital Infrastructure; Multiple Tracks of Innovation
Overlapping technology waves provide secular growth opportunities
2022
2024
2026
2028
2030 & Beyond
15:56
Wireless
5G & 6G
Virtual RAN
Devices & loT
Wireline
Photonics
Switching Fabric
High-Speed
Ethernet
Computing
HPC
Advanced Silicon
High-Speed
Interfaces
5G - Rel-17 (RedCap, power saving), Rel-18 (NTN evolution, Sidelink), Rel-19
6G - Research, pre-standard development, standardization, trials
Open RAN - 2 releases/year, RU, DU, CU, RIC applications
Enterprise WiFi ā WiFi6e, 7, 8, 9
-
ASICSS - 25.6Tbps, 51.2Tbps, 102.4Tbps
I/O SERDES - 56Gbps, 112Gbps, 224Gbps, 448Gbps
Ethernet - 800GE, 1.6TE, 3.2TE, 6.4TE
SmartNICS - 200Gbps, 400Gbps, 800Gbps, 1.6Tbps
Optics - 800Gbps, 1.6Tbps, 3.2Tbps, 6.4Tbps
Semi Nodes - 7nm FinFET, 6nm FinFET, 6nm GAA, 5nm GAA, 4nm CFET
Quantum - Hundreds of qubits, low 1000s of qubits, tens of 1000s of qubits
DRAM - DDR5, DDR6, DDR7, GDDR5, GDDR6, GDDR7
USB - USB 3.x, USB4, USB4 2.0
PCle-PCle5.0, PCle6.0, PCle7.0
10X Higher Bandwidth
5X Lower Latency
10X QoS & Use Cases
8X Higher Data Rates
9X Al Bandwidth/GPU
6X Lower Power/Gb
5X Higher Density
1000X Higher Flops
2X Lower Power
ā KEYSIGHT
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