2021 Focus and Future Growth Drivers - TSEM Corporate Overview slide image

2021 Focus and Future Growth Drivers - TSEM Corporate Overview

Stitching on 300mm wafers for X-Ray and high-end photography sensors 1die per wafer product Radiography 2dies per wafer product Fluoroscopy (hand) Tower Semiconductor Confidential and Proprietary Information herein shall not be furnished to third parties or made public Tower Semiconductor
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