Q3 2023 Financial Performance and Strategic Highlights
Next-generation LED production is key enabler for significant microLED shrink
Shrink required to reach acceptable cost level for high-volume applications
>30μm
>15μm
Status today: Die sizes in
existing products typically in the
range of 35x60μm² to 15x30μm²
1 to 4
4k displays
1 wafer per color
Chip cost too high for market
breakthrough of microLED
technology
Massive die shrink required for mass adoption
Key enabler: 8" LED manufacturing
Modern state-of-the art and first 8" fab for advanced LED technologies
Fully automated material handling system and factory control,
advanced process control and material scheduling and fault detection
(FDC) technologies
SMIF concept that allows lowest defect densities required for
advanced (u)LED manufacturing
Fab built in industry record time: 1 year from start of construction to
first wafer starts
amin as
ams OSRAM focus:
Very small die sizes
25 to >80
4k displays
1 wafer per color
Acceptable LED cost for high-
volume applications
12
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amu OSRAMView entire presentation