Micron Investor Day 2022

Introducing EUV at the right time Technology and cost leadership with multiple patterning through 1ẞ DRAM CY24 ramp with EUV ☐ ☐ More advanced tools Improved equipment reliability, productivity and performance Maturity of enabling technologies (reticles, resists) Differentiation enabled at 1y EUV lithography productivity CY18-20 CY21-23 Micron intercepting EUV on 1y CY24+ Optimized solution: Multiple EUV layers plus appropriate use of advanced multiple patterning 193nm technology Micron 51 14

View entire presentation