High Performance Computing Capabilities

Amkor's Turnkey Service Offering Reduce Cycle Time, Increase Value Design Innovation Materials Wafer Bump, Management Probe, Dicing Package Assembly Final Test Drop SLT Ship Amkor WLFO Memory Amkor Technology® Amkor fcCSP Flip Chip, PoP MCM, 2.5D, 3D SiP, Heterogeneous Integration MEMS & Sensors Leadframe, Power © 2023 Amkor Technology, Inc. 6

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