Onto Innovation Investor Presentation

Revenue Distribution Across the Value Chain SOFTWARE AND SERVICE CUSTOMERS ADVANCED NODES CUSTOMERS SPECIALTY & ADVANCED PACKAGING CUSTOMERS tsme Wafer Fabrication SAMSUNG Bare Wafer Manufacturing Specialty Devices & Advanced Packaging SAMSUNG Balanced Q1 2022 Revenue Distribution across the Semiconductor Value Chain 17% Shin Etsu tsme ASE GROUP UMC BAL UNDRIES S MCO (siltronic perfect silicon solutions. 42% RF360 A Qualcomm TDK Joint Venture Powertech PTI Technology Inc. SK hynix KIOXIA Micron (intel) SK siltron SEMICONDUCTORS GJCET Infineon Amkor Technology Wwin BOSCH NX- 41% Advanced Nodes ■Advanced Packaging & Specialty Software & Service BROADCOM® Y GWJ Global Wafers Japan nees SK hynix (intel) The above logos are representative trademarks or registered ® trademarks of their respective holders-not listed by rank order of revenue. Use of these logos does not imply any affiliation with or endorsement by them. 4 innovationTM onto

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