Monetizing Innovation and Financial Reconciliation
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Next-generation LED production is key enabler for significant microLED shrink
Shrink required to reach acceptable cost level for high-volume applications
Status today: Die sizes in
existing products typically in the
range of 35x60μm² to 15x30μm²
1 to 4
4k displays
1 wafer per color
Chip cost too high for market
breakthrough of microLED
technology
Massive die shrink required for mass adoption
Key enabler: 8" LED manufacturing
Modern state-of-the art and first 8" fab for advanced LED technologies
Fully automated material handling system and factory control,
advanced process control and material scheduling and fault detection
(FDC) technologies
SMIF concept that allows lowest defect densities required for
advanced (u)LED manufacturing
Fab built in industry record time: 1 year from start of construction to
first wafer starts
amin SAM
ams OSRAM focus: Die
sizes of 10x10μm and below
25 to >80
4k displays
1 wafer per color
Acceptable LED cost for high-
volume applications
amu OSRAMView entire presentation