Investor Presentaiton
Market Orientation
Semiconductor front-end process equipment
Upstream
Mid-stream
Downstream
IC Manufacturing
(Foundry/Memory)
IC Packaging & Testing
IC
Module
IP Design
/IC Design
OEM
Goods & Services
3413.TT
Automation equipment
Layer 5
Business
Layer 4
Factory
Layer 3 System
+
Flexibility Service
IC Design
Manufacturi
ng
Manufacturing
&
&
Mask Chemicals
Substrate
Inspection
equipment
Inspection
equipment
Lead
Frame
Speed
Cost
IC
Channel
Layer 2 Machine
Contract Manufacture Business Model
Component
Module
Machine parts
• Sheet metal
• PCBA
• Cable harness
• Surface treatment
• Welding
• Testing & CMM
Layer 1 Component
Move
Service
• Mechanical
assembly
.
• System assembly ⚫ Refurbish Service
• ODM/JDM design
• Client-side
One-stop shop for integrated service solution
Electrical
assembly
inventory mgnt
• Virtual Factory
.
• Equipment
Sub-system
assembly
• Concurrent System installation
Design
• Global logistics
Customize
Module
Intelligent
2017/8/28
Foxsemicon integrated technology inc.
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