Investor Presentaiton

Strengthening market position in advanced packaging Chiplet architecture: Inter-die gapfill Win in June quarter at a key foundry-logic customer to drive leading share position for this application across top 3 foundry-logic customers Higher productivity results by leveraging our unique architecture and multi-station design, allowing more wafers to run between clean steps Superior on-wafer performance with better film stress management, improved defectivity, and enhanced uniformity LAM RESEARCH

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