ASMPT Advanced Packaging Solutions

TCB - Key Enabler for Generative Al and HPC Accelerated Adoption of TCB ASMPT digital world Generative Al Chip Demand Drivers Accelerated TCB Adoption Increased number of logic chiplets & new generation HBM Exponential increase in interconnects ~90% handled by TCB TCB Equipment Market * Inflection Point FY12 FY24 * Source: Company management's estimates ASMPT's Unique TCB Capabilities • Best in class die placement accuracy (<1 μm) • Thin die handling • Ultra fine pitch bonding • (<15 μm) Multi die format (up to 100x100mm) 6

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