2021 Focus and Future Growth Drivers - TSEM Corporate Overview

RF: 300mm Opportunity The ability to print smaller dimensions on 300mm wafers has enabled Tower to expand its Analog IC markets to include: ■ Smaller geometry RF SOI with enhanced LNA and digital integration - — 65nm RF SOI: 4x smaller digital and improved LNA performance for 4G and 5G Now ramped to high volume ▪ 65nm SiGe for next generation optical and mmWave products . Enabling SiGe with high performance CMOS and dramatically higher digital density Tower Semiconductor Confidential and Proprietary Information herein shall not be furnished to third parties or made public Tower Semiconductor

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