Investor Presentaiton

Flip Chip & Advanced Packaging Leader Migration to Flip Chip, 3D and Advanced Packaging Continues to Accelerate ■ Driven by Strong Demand for Smartphones, Tablets, Consumer Electronics, Network Infrastructure ■ Enhances Device Performance, Reduces Power Consumption and Form Factors Higher Gross Margin and Returns Versus Wirebond Amkor TechnologyⓇ LTM 1Q13 Flip Chip & Advanced Packaging Revenue ($ in millions) $800 $530 $870 $1,230 ECONOIMC NEWS 12:56 © 2013 Amkor Technology, Inc. Amkor Confidential Information STATS SPIL ASE Amkor Non-Amkor Sources: Company Press Releases 10

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