KLA Investor Conference Presentation Deck

Advanced Packaging Key Collaborations HBM Stack Molding Interposer Molding HBM Stack & GPU Underfill kcording macro burre VID CPU-bump Be Die Stacking Process sokern, Ag, Cu) 31 μm has de mizo-lum (Ca) 230μm DRAM Underfill Interposer und PROC induced during cross section DRAM DRAM DRAM DRAM DI DI D DI II 24 KLA Non-Confidential | Unrestricted Defectivity Reduction SiO₂ Al void Cu Crack seam ~0.3μm DOI Metrology and Process Control Dishing Depth Device Height Carrier Height Active Projects with Top5 Semiconductor Companies 15:42 14.58 Cu TEOS Total Height 88 KLA+

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