Navitas SPAC Presentation Deck slide image

Navitas SPAC Presentation Deck

Navitas Has Overcome Key Hurdles To Commercialization ‒‒‒‒‒‒ ‒‒‒‒‒‒ ‒‒‒‒‒‒ ‒‒‒‒‒‒ Manufacturability Reliability Complexity Cost O Navitas Semiconductor 2021 Significant Barriers to Entry Poor Manufacturing / Yields Material mismatch (GaN / Silicon) Poor Reliability Defect densities Extra System Components Difficult to drive, control and protect GaN FET High Manufacturing Costs 2x-3x Si Limited GaN production capacity Founding Team with 30+ Years of GaN Experience Proprietary GaN IC Stable >90% Yields(¹) Navitas Fully-Qualified, >1B Device Hours Tested, >18Mu Shipped (2), Zero Field Failures (³) Single Integrated IC Solution Low GaN Manufacturing Costs Volume, Integration & Manufacturing Leadership (1) Based on Navitas production data over prior 6 months for highest volume products based on wafer-level and final test yield results. Based on cumulative production shipments through Q1 2021. (2) (3) Based on no customer-reported consumer failures for production shipments through March 2021. 12
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