GlobalFoundries Investor Presentation Deck
Smart Mobile Devices
4G LTE/5G: RF
FE Sub-6GHz
RF SOI
Higher Data Rate
Power Efficiency
5G: RF FE
mmWave
FDX™
Expanded Range
Power Efficiency
4G LTE/5G:
Transceiver
FinFET
Higher Data Rate
Power Efficiency
Wi-Fi: Wi-Fi 6/6E
FinFET
Higher Data Rate
Power Efficiency
Camera: Optical Imaging
Feature-Rich CMOS
Sensor Fusion
Power Efficiency
Smart Audio
Feature-Rich CMOS (BCD, eNVM)
Audio Quality
Haptic Response
Secure Payment: NFC
Feature-Rich CMOS (eNVM)
Integration of NFC+ Secure Element
Secure Manufacturing
Touch Screen: Display
Feature-Rich CMOS
Functional Integration
Power Efficiency
Power Management: RF, Audio
Feature-Rich CMOS (BCDLite®), FDX™
Increased Efficiency
Smaller Form Factor
GF has 75% of Silicon area in
top premier smartphones in RF
FE, Audio & NFC
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