AMD Investor Presentation Deck

18 AMD 3D Chiplet Technology Breakthrough Packaging Technology for High-Performance Computing >200X Interconnect Density Compared to On-Package 2D Chiplet AMD CORPORATE PRESENTATION | MAY 2022 >15X Interconnect Density Compared to Micro Bump 3D >3X Interconnect Energy Efficiency Compared to Micro Bump 3D Enabling 3rd Gen AMD EPYC™ Processors with AMD 3D V-Cache ™ See endnotes: EPYC-025; EPYC-026 AMD

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