AMD Investor Day Presentation Deck

AMD CHIPLET AND PACKAGING LEADERSHIP AMD 2.5D HBM XILINX. 2015 1.0.1... World's Highest Capacity FPGA in 20nm 2015 Multichip Module 2017 Chiplets 2019 VIRTEX World's Highest Capacity FPGA in 16nm 2019 AMD 3D V-Cache™ MI200 2.5D EFB 2021 VERSAL (PREMUN Versal™ Premium ====⠀⠀⠀⠀⠀⠀⠀⠀⠀‒‒‒‒‒‒‒‒‒‒‒ 2021 2022 MUNG VERSAL Versal 2.5D 2022 3D/2.5D HYBRID COMPUTE FUTURE

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