KLA Investor Conference Presentation Deck

Advanced Packaging Ecosystem XPU intel. intel. SmC EDUKIDE DODA 2.5D ▪ 3D SoC with cache memory on uP cores for HPC Hybrid bonding for high interconnect density and low power I ULUDA ANCIEN tsmc T ■ Amkor Technology® AMD 23 KLA Non-Confidential | Unrestricted XXILINX ▪ 2.5D interposer-based die partitioning with TSV Competition by TSV-less interposer like RDL or HD-FO ▪ Heterogeneous integration ASE GROUP ▪ 3D-IC DRAM die stacked on logic ▪ HBM demand increasing for Al and data centers Hybrid bonding expected HVM in 2022-23 ■ SAMSUNG ■ intel. ▪ IC substrate scaling to 5/5μm and below ABF roadmap for L/S scaling SK hynix AT&S HBM Micron GILLIES ANON tsmc Unimicron 欣興電子 Substrate KLA+

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