Rigetti SPAC Presentation Deck

Proprietary technology unlocked by 6+ years of fab- driven innovation Superconducting caps Developed 2015 - 2018 Facilitates scaling and enhances performance² + Superconducting TSVs Developed 2016-2019 Isolates on-chip components and maximizes performance³ + 21 patents pending and issued¹ Pictured: Rigetti modular, multi-chip quantum processor Interchip Coupling Developed 2018-2021 Interchip coupling enables fast gates and scaling qubit fabric across multiple chips4 1 Covering aspects of the modular, multi-chip quantum processor and the modular system architecture described herein. 2 O'Brien, William, et al. "Superconducting Caps for Quantum Integrated Circuits." ArXiv:1708.02219 [Physics, Physics:Quant-Ph], Aug. 2017. arXiv.org. 3 Vahidpour, Mehrnoosh, et al. "Superconducting Through-Silicon Vias for Quantum Integrated Circuits." ArXiv:1708.02226 [Physics, Physics:Quant-Ph], Aug. 2017. arXiv.org. 4 Gold, Alysson, et al. "Entanglement Across Separate Silicon Dies in a Modular Superconducting Qubit Device." ArXiv:2102.13293 [Quant-Ph], Mar. 2021. arXiv.org. 25 rigetti

View entire presentation